PEER-REVIEWED PUBLICATION

2026

Crack-Controlled Adhesive Interface for Payload-Bearing Robotic Manipulation with Directional Release

A tensile test divider icon

Kang DK, Park S, et al.

International Journal of Precision Engineering and Manufacturing-Green Technology

Ulsan National Institute of Science and Technology, Korea Advanced Institute of Science and Technology, Seoul National University

RESEARCH SUMMARY
This study developed a crack-controlled adhesive manipulation interface designed to support payload-bearing robotic manipulation while enabling predictable directional release without external actuation, vacuum, or complex release hardware. The interface, termed CAMI, integrates hexagonal mushroom-tipped PDMS micropillars with a directional nonlinear open-cut architecture. The micropillar array provides strong normal adhesion by increasing real contact area, redistributing interfacial stress, and repeatedly arresting microscale cracks during detachment, while the nonlinear cut pattern programs macroscale crack propagation to create strong peel resistance in load-bearing directions and facile release in a selected direction. The CAMI achieved a pull-off strength of 249.7 kPa, retained stable pull-off performance over more than 100 attachment-detachment cycles, and supported a 1 kg payload over a 1 cm² contact area. Peel testing showed a maximum peel capacity of 209.5 N/m in the maximum-force direction and a directionality ratio of 10.7, demonstrating strong adhesion asymmetry. Spatial peel mapping confirmed that the cut layout created mirrored high-adhesion lateral domains, an intermediate stabilization direction, and a low-resistance release direction. When mounted on a robotic end-effector, CAMI supported a 1 kg payload up to 30.2° in the load-bearing direction and released at only 6.3° in the programmed release direction. Overall, the work demonstrates a passive structurally programmed adhesive system for repeatable robotic pick-and-place manipulation, where attachment, stabilization, and release are governed by engineered crack pathways.
CellScale hexagons, without text

CELLSCALE INSTRUMENT USED

UniVert

A CellScale UniVert mechanical tester was used to quantify 90° peel capacity of the CAMI and control adhesive samples on smooth glass substrates. CAMI strips or control adhesive strips with a total length of 60 mm were fixed at one end to a glass slide using Kapton tape and clamped at the opposite end in the motorized grip. Before testing, each sample was pressed uniformly onto the glass substrate using a rubber roller and allowed to dwell for 3 minutes to stabilize interfacial contact. Peeling was then performed at a constant peel rate of 1 mm/s while peel force was continuously recorded. The UniVert measurements compared planar PDMS, PDMS micropillars, commercial pressure-sensitive adhesive tape, planar PDMS with nonlinear cuts, and the combined CAMI architecture. These data showed that the CAMI reached a maximum peel capacity of 209.5 N/m in the maximum-force direction, exceeding planar PDMS, micropillar-only PDMS, PSA tape, and cut-only Meta controls by 77.6x, 21.3x, 6.4x, and 2.3x, respectively. The same UniVert peel testing also demonstrated strong directional asymmetry, with CAMI achieving a directionality ratio of 10.7. These measurements were central to validating that the combined micropillar and nonlinear-cut architecture produces high peel resistance in load-bearing directions while maintaining a low-resistance programmed release pathway.
AUTHORS

Dong Kwan Kang, Seongjin Park, Hee Jin Lee, Seongjin Lee, Dohyeon Kwon, Eunsoo Jo, Geonjun Choi, Hosup Jung, Hoon Eui Jeong.

PUBLICATION DETAILS
JOURNAL

International Journal of Precision Engineering and Manufacturing-Green Technology

YEAR

2026

INSTITUTIONS

Ulsan National Institute of Science and Technology, Korea Advanced Institute of Science and Technology, Seoul National University

COUNTRIES

South Korea

INSTRUMENT USED

UniVert

TESTING METHODS

Peel Testing

RESEARCH APPLICATIONS

Adhesives and Sealants TestingPolymers and Elastomers TestingSoft Robotics Materials

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Product of Interest:
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