PEER-REVIEWED PUBLICATION

2025

Multilayer relaxor ferroelectric polymer stacks as data transmitter for real-time and programmable infrared information encryption

Zhu Y, Wu J, et al.

Nature Communications

University of California – Los Angeles

RESEARCH SUMMARY
This work presents a multilayer relaxor ferroelectric polymer (RFP) stack capable of generating precise, real-time thermal waveforms for infrared (IR) information encryption. Using a bistable adhesion polymer (BAP) as a thermally switchable transfer medium, the authors construct multilayer P(VDF-TrFE-CFE) stacks without introducing inactive thermal loads, enabling up to eight layers bonded cleanly while preserving dielectric strength. Electrocaloric testing shows that each layer contributes additively to heat generation, producing a rectangular temperature wave between 22.1 °C and 26.3 °C under 80 MV/m, with rapid response rates (~0.012 s/K). The 8-layer stack maintains elevated temperature for ~8 s following field removal due to reduced convective heat dissipation. Infrared encryption demonstrations—including Morse-code signaling and a seven-segment IR display—highlight the system’s real-time programmability and speed advantages over thermochromic and electrochromic alternatives. This multilayer strategy establishes a scalable pathway to high-speed IR-based communication and encryption devices.

CELLSCALE INSTRUMENT USED

UniVert

Mechanical adhesion characterization was performed using a CellScale UniVert mechanical testing system equipped with a 50 N load cell. A 90° peeling test (speed 0.3 mm/s; sample width 1 inch) quantified peel strength at the BAP/terpolymer and terpolymer/terpolymer interfaces under varying temperatures. UniVert force–displacement data validated that BAP provides high adhesion at elevated temperature for layer pickup and low adhesion at room temperature for clean release, ensuring structural integrity during multilayer assembly. These measurements were critical for optimizing the transfer process and ensuring reliable multilayer bonding.
AUTHORS

Yingke Zhu, Jianghan Wu, Yang Luo, Kede Liu, Hyeonji Hong, Yuxuan Guo, Yuan Meng, Meng Gao, Hanxiang Wu, Jiacheng Fan, Yingjie Du, Ping He, Qibing Pei.

PUBLICATION DETAILS
JOURNAL

Nature Communications

YEAR

2025

INSTITUTIONS

University of California – Los Angeles

COUNTRIES

United States

INSTRUMENT USED

UniVert

TESTING METHODS

Peel Testing

RESEARCH APPLICATIONS

Adhesives and Sealants TestingElectroactive and Photothermal PolymersPolymers and Elastomers TestingWearable Bioelectronics

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