Motion-Adaptive Tessellated Skin Patches with Switchable Adhesion for Wearable Electronics

This study introduces a motion-adaptive, tessellated skin patch (TSP) composed of rigid and compliant shape memory polymer (SMP) nanocomposite segments arranged in a patterned array. Inspired by barnacle adhesion and armadillo flexibility, the hybrid design achieves robust, switchable skin adhesion (>1000 kPa), outstanding deformability (up to 550% areal strain), and motion adaptability while integrating electronic modules such as sensors, batteries, and circuits. Thermal control enables reversible adhesion via SMP phase transitions, allowing secure attachment, wireless physiological signal monitoring, and gentle, damage-free detachment. Integrated Ag nanowire electrodes provide low impedance (44 kΩ at 10 Hz) and high SNR (>22 dB) during dynamic motion, demonstrating real-time ECG, PPG, and blood-pressure monitoring.